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CLD-AP90 rev 0 soldering & handling cree ? xlamp ? xb-d leds www.cr ee.com/xlamp table of contents cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 introduction this application note applies to xlamp xb-d l eds which have order codes in the following format. xbdxxx-xx-xxxx-xxxxxxxxx this application note explains how xlamp xb-d l eds and assemblies containing these l e ds should be handled during manufacturing. please read the entire document to understand how to properly handle xlamp xb-d l eds. handling xlamp xb-d l eds ................................. 2 circuit board preparation & layouts ...................... 4 case temperature (t s ) measurement point ............. 4 notes on soldering xlamp xb-d l eds ................... 5 moisture sensitivity ............................................ 6 xlamp xb-d led refow soldering characteristics .. 7 chemicals & conformal coatings .......................... 8 assembly storage & handling ............................... 9 tape and reel - xb-d l eds ................................ 10 packaging & labels ........................................... 11 copyright ? 2012 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. this document is provided for informational purposes only and is not a warranty or a specifcation. for product specifcations, please see the data sheets available at www.cree.com. cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 www.cree.com/xlamp
2 2 handling xlamp xb-d leds manual handling use tweezers to grab xlamp xb-d l e ds at the base. do not touch the lens with the tweezers. do not touch the lens with fngers. do not push on the lens. do not apply more than 1000 g of shear force onto the lens. e xcessive force on the lens could damage the le d. cree recommends the following at all times when handling xlamp xb-d l eds or assemblies containing these leds: ? avoid putting excessive mechanical stress on the l ed lens. ? never touch the optical surface with fngers or sharp objects. the led lens surface could be soiled or damaged, which would affect the optical performance of the le d. whenever possible, cree recommends the use of a pick & place tool to remove xlamp xb-d l e ds from the factory tape & reel packaging. x wrong p correct xlamp xb-d led soldering & handling copyright ? 2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. copyright ? 2012 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. this document is provided for informational purposes only and is not a warranty or a specifcation. for product specifcations, please see the data sheets available at www.cree.com.
3 3 pick & place nozzle for pick and place nozzles coming into contact with silicone-covered led components, cree recommends nozzles be constructed of non-metallic materials. cree and several of crees customers have had good success using nozzles fabricated from tefon or from 90d urethane. the following pick & place tool is specifc to the xb family leds. all dimensions in mm. size title of rev. sheet c drawing no. date date date check final protective finish material approved drawn by third angle projection scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d phone (919) 313-5300 fax (919) 313-5558 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice x .5 .xxx .25 .xx .75 .x 1.5 for sheet metal parts only .xx .25 .xxx .125 x .5 unless otherwise specified dimensions are in millimeters and after finish. tolerance unless specified: surface finish: 1.6 4.500 1.125 4x 15.0 2.500 +.100/-.000 2.500 +.100/-.000 .050 thru 2.300 4x r .200 +.050/-.000 x 90 2.400 5.500 1 / 1 13.000 a 12002494 tool, pickup-xb-d delrin 1/5/12 don hirsh 1/5/12 d. seibel revisons rev description by date app'd a initial release dds 1/5/12 d. h. add features as required to interface with customer's tool xlamp xb-d led soldering & handling copyright ? 2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. copyright ? 2012 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. this document is provided for informational purposes only and is not a warranty or a specifcation. for product specifcations, please see the data sheets available at www.cree.com.
4 4 circuit board preparation & layouts printed circuit boards (pcbs) should be prepared and/or cleaned according to the manufacturers specifcations before placing or soldering xlamp xb-d l e ds onto the pcb. the diagram below shows the recommended pcb solder pad layout for xlamp xb-d l eds. case temperature (t s ) measurement point xlamp xb-d l e d case temperature (t s ) should be measured on the pcb surface, as close to the l e ds thermal pad as possible. this measurement point is shown in the picture below. it is not required to use a solder footprint for the thermal pad that is larger than the xlamp xb-d l e d itself. in testing, cree has found such a solder pad to have insignifcant impact on the resulting t s measurement. size title of rev. sheet c drawing no. date date date check final protective finish material approved drawn by third angle projection scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d phone (919) 313-5300 fax (919) 313-5558 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice x .5 .xxx .25 .xx .75 .x 1.5 for sheet metal parts only .xx .25 .xxx .125 x .5 unless otherwise specified dimensions are in millimeters and after finish. tolerance unless specified: surface finish: 1.6 2.45 2.45 0.65 0.76 1.84 0.355 2.285 0.923 0.462 0.817 1.633 r 1.086 0.82 0.36 0.46 2.34 0.36 0.28 0.36 0.92 2.34 2.272 1.136 2.272 0.284 0.284 0.426 0.852 0.426 0.284 1 / 1 30.000 a 2610-00019 2525 sbc hew outline -- -- -- -- -- 09/19/11 d. cronin revisons rev description by date app'd recommended pcb solder pad recommended stencil pattern (hatched area is opening) recommended pcb solder pad recommended stencil pattern pad for thermocouple thermocouple site if no separate pad all dimensions in mm. xlamp xb-d led soldering & handling copyright ? 2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. copyright ? 2012 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. this document is provided for informational purposes only and is not a warranty or a specifcation. for product specifcations, please see the data sheets available at www.cree.com.
5 5 notes on soldering xlamp xb-d leds xlamp xb-d leds are designed to be refow soldered to a pcb. refow soldering may be done by a refow oven or by placing the pcb on a hotplate and following the refow soldering profle listed on the previous page. do not wave solder xlamp xb-d l e ds. do not hand solder xlamp xb-d leds. x wrong p correct p correct solder paste type cree strongly recommends using no clean solder pas t e wit h xlamp mpl - ezw leds so that cleaning the pcb after reflow soldering is not required. cree uses the following solder paste internally: indium corporation of america part number 82676 sn62/ pb36 /ag2 composition flux: nc - smq92j cree recommends the followi ng solder paste compositions: snpbag, snagcu and snag. solder paste thickness the choice of solder and the application method will dictate the specific amount of solder. for the most consistent results an automated dispensing system or a solder stenc il printer is recommended. cree has seen positive results using solder thickness that results in a post reflow 3 - mil (75m) bond line. solder paste type cree strongly recommends using no clean solder paste with xlamp xb-d leds so that cleaning the pcb after refow soldering is not required. cree uses the following solder paste internally. indium corporation of america? part number 82676 ? sn62/pb36/ag2 composition ? flux: nc-smq92j cree recommends the following solder paste compositions: snpbag, snagcu and snag. solder paste thickness the choice of solder and the application method will dictate the specifc amount of solder. for the most consistent results, an automated dispensing system or a solder stencil printer is recommended. cree has seen positive results using solder thickness that results in a 3-mil (75-m) bond line. p correct x wrong xlamp xb-d led soldering & handling copyright ? 2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. copyright ? 2012 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. this document is provided for informational purposes only and is not a warranty or a specifcation. for product specifcations, please see the data sheets available at www.cree.com.
6 6 after soldering after soldering, allow xlamp xb-d l e ds to return to room temperature before subsequent handling. handling of the device, especially around the lens, before cooling could result in damage to the le d. cree recommends verifying the solder process by checking the consistency of the solder bond of several trial pcbs after refow. this can be done by x-ray or by shearing selected devices from the circuit board. the solder should appear completely re-fown (no solder grains evident). the solder areas should show minimum evidence of voids on the backside of the package and the pcb. cleaning pcbs after soldering cree recommends using no clean solder paste so that fux cleaning is not necessary after refow soldering. if pcb cleaning is necessary, cree recommends the use of isopropyl alcohol (ipa). do not use ultrasonic cleaning. moisture sensitivity in testing, cree has found xlamp xb-d leds to have unlimited foor life in conditions 30 oc / 85% relative humidity (rh). however, cree recommends keeping xlamp l e ds in their sealed moisture-barrier packaging until immediately prior to use. cree also recommends returning any unused l e ds to the resealable moisture-barrier bag and closing the bag immediately after use. moisture testing included a 168-hour soak at 85 oc / 85% rh followed by 3 refow cycles, with visual and electrical inspections at each stage. xlamp xb-d led soldering & handling copyright ? 2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. copyright ? 2012 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. this document is provided for informational purposes only and is not a warranty or a specifcation. for product specifcations, please see the data sheets available at www.cree.com.
7 7 xlamp xb-d led reflow soldering characteristics in testing, cree has found xlamp xb-d leds to be compatible with jedec j-std-020c, using the parameters listed below. as a general guideline, cree recommends that users follow the recommended soldering profle provided by the manufacturer of solder paste used. note that this general guideline is offered as a starting point and may require adjustment for certain pcb designs and confgurations of refow soldering equipment. profle feature lead-based solder lead-free solder average ramp-up rate (ts max to tp) 3 c/second max. 3 c/second max. preheat: temperature min (ts min ) 100 c 150 c preheat: temperature max (ts max ) 150 c 200 c preheat: time (ts min to ts max ) 60-120 seconds 60-180 seconds time maintained above: temperature (t l ) 183 c 217 c time maintained above: time (t l ) 60-150 seconds 60-150 seconds peak/classifcation temperature (tp) 215 c 260 c time within 5 c of actual peak temperature (tp) 10-30 seconds 20-40 seconds ramp-down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package, measured on the package body surface. xlamp xb-d led soldering & handling copyright ? 2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. copyright ? 2012 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. this document is provided for informational purposes only and is not a warranty or a specifcation. for product specifcations, please see the data sheets available at www.cree.com.
8 8 chemicals & conformal coatings below are representative lists of chemicals and materials to be used or avoided in led manufacturing activities. for a complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult crees chemical compatibility application note (www.cree.com/products/pdf/xlamp_chemical_comp.pdf). the video at www.youtube. com/watch?v=t24bf9d_1sa illustrates the process cree has developed for testing the compatibility of chemicals and materials with leds. you should also consult your regional cree field applications engineer. recommended cleaning solutions cree has found the following chemicals to be safe to use with xlamp xb-d l eds. ? water ? isopropyl alcohol (ipa) chemicals tested as harmful in general, subject to the specifcs in crees chemical compatibility application note, cree has found certain chemicals to be harmful to xlamp xb-d l e ds. cree recommends not using these chemicals anywhere in an le d system containing xlamp xb-d l e ds. the fumes from even small amounts of the chemicals may damage the leds. ? chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene) ? methyl acetate or ethyl acetate (i.e., nail polish remover) ? cyanoacrylates (i.e., superglue) ? glycol ethers (including radio shack? precision e lectronics cleaner - dipropylene glycol monomethyl ether) ? formaldehyde or butadiene (including ashland pliobond? adhesive) potential of silver tarnishing xlamp xb-d l e ds contain silver plated parts that may tarnish (turn black) over time when exposed to oxidizing substances such as sulfur, chlorine, or other halogen compounds. oxidation of the leads can reduce the ability to make a good solder connection and affect the light output of the l e d. e xposure to oxidizing substances can come from materials used near the led during manufacturing or from the air around the le ds during storage. to reduce the potential of tarnishing for xlamp xb-d l e ds, cree recommends that customers minimize exposure of the l e ds to oxidizing substances at all times, including dry box storage, manufacturing and product testing. potential sources of oxidizing substances include paper, air flters, some cleaning chemicals, cardboard boxes and rubber anti- static mats. xlamp xb-d led soldering & handling copyright ? 2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. copyright ? 2012 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. this document is provided for informational purposes only and is not a warranty or a specifcation. for product specifcations, please see the data sheets available at www.cree.com.
9 9 assembly storage & handling do not stack pcbs or assemblies containing xlamp xb-d leds so that anything rests on the led lens. force applied to the l e d lens may result in the lens being knocked off. pcbs or assemblies containing xlamp xb-d le ds should be stacked in a way to allow at least 2 cm clearance above the led lens. do not use bubble wrap directly on top of xlamp xb-d leds. force from the bubble wrap can potentially damage the le d. x wrong p correct p correct xlamp xb-d led soldering & handling copyright ? 2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. copyright ? 2012 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. this document is provided for informational purposes only and is not a warranty or a specifcation. for product specifcations, please see the data sheets available at www.cree.com.
10 10 tape and reel - xb-d leds all cree carrier tapes conform to e ia-481d, automated component handling systems standard. all dimensions in mm. loaded pockets (1,000 lamps) leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) start end cathode side anode side (denoted by + and circle) 160.0 a a b 2.5 .1 section a-a scale 2 : 1 1.5 .1 8.0 .1 4.0 .1 1.75 .10 12.0 .0 + .3 detail b scale 2 : 1 13 mm 7" cover tape pocket tape user feed direction user feed direction size title of rev. sheet c drawing no. date date date check final protective finish material approved drawn by third angle projection scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d phone (919) 313-5300 fax (919) 313-5558 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice x .5 .xxx .25 .xx .75 .x 1.5 for sheet metal parts only .xx .25 .xxx .125 x .5 unless otherwise specified dimensions are in millimeters and after finish. tolerance unless specified: surface finish: 1.6 b b 8.00 .10 4.00 .10 2.00 .10 +.10/-.00 1.50 .10 1.50 .30 .10 12.00 nominal 12.30 max 5.50 .10 1.75 .10 10.25 .10 2.7 2.000 +/-.10 revisons rev description by date app'd a released dc 10/23/11 jl 1 / 1 4.000 a 2402-00020 carrier tape, 2525 hew 10/23/11 d. cronin notes: 1. 10 sprocket hole pitch cumulative tolerance 0.2mm reference vendor part number 020246 b-b section xlamp xb-d led soldering & handling copyright ? 2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. copyright ? 2012 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. this document is provided for informational purposes only and is not a warranty or a specifcation. for product specifcations, please see the data sheets available at www.cree.com.
11 11 packaging & labels the diagrams below show the packaging and labels cree will use to ship xlamp xb-d l e ds. xlamp xb-d le ds are shipped in tape loaded on a reel. e ach moisture barrier bag contains only one reel. e ach box may contain multiple reels. cree bin code & barcode label vacuum-sealed moisture barrier bag label with customer p/n, qty, lot #, po # desiccant (inside bag) humidity indicator (inside bag) label with cree bin code, q t y , lot # label with cree bin code, q t y , lot # v acuum - sealed moisture barrier bag dessicant (inside bag) humidi t y indicator card (inside bag) p atent label label with customer order code, q t y , r eel i d , po # label with customer order code, qty, reel id, po# label with cree bin code, qty, lot # cree bin code & barcode label vacuum-sealed moisture barrier bag label with customer p/n, qty, lot #, po # label with cree bin code, q t y , lot # label with cree bin code, q t y , lot # v acuum - sealed moisture barrier bag p atent label label with customer order code, q t y , r eel i d , po # xlamp xb-d led soldering & handling copyright ? 2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. copyright ? 2012 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree, the cree logo and xlamp are registered trademarks of cree, inc. this document is provided for informational purposes only and is not a warranty or a specifcation. for product specifcations, please see the data sheets available at www.cree.com.

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